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Space Station Electrical Bonding Requirements

This requirements document defines the Space Station electrical bonding requirements in
accordance with SSP 30243, Space Station Systems Requirements for Electromagnetic
Compatibility (EMC), and SSP 30240, Space Station Grounding Requirements. These
requirements address the characteristics, application, and testing of electrical bonding. Joining
of surfaces, objects, equipment, and structures shall satisfy the requirements of this document,
regardless of application or conductivity.
These bonding requirements and tests are intended to ensure that the Space Station is free from
such hazards as electrical shock and static discharge. In addition, these requirements provide for
reliable fault clearing paths and the suppression of electromagnetic interference.
The electrical bonding classifications for the joining of all surfaces, objects, equipment and
structures as defined in this document delineate a uniform methodology and performance that
Will result in a safe, reliable spacecraft with a uniform bonding design.
This requirements document is intended to define the requirements for bonding and joining of
materials, equipment, flight elements and structural components provided by program
participants.
SSP 41000, defines the EMC design and performance requirements for the Space Station
Program (SSP) by invoking SSP 30243. In the event of any conflict between SSP 30243 and
this document, SSP 30243 shall take precedence.
SSP 30245 Revision E 15 October 1999
The documents in this paragraph, of the exact issue shown in the current issue of SSP 50258, are
applicable to the extent specified herein. Inclusion of applicable documents herein does not in
any way supersede the order of precedence identified in 1.5. The references show where each
applicable document is cited in this document.